Photo resist stripper
After the photoresist has been developed, the copper bild-up and the through-hole plating have been occurred through galvanization, and finally the tin etch resist has ben applied by galvanization, the polymerized photo resist has to be stripped again and removed. Our photoresist strippers have been specially developed for printed circuit board technology and are used to strip aqueous alkaline photoresists that have been applied as galvanic etch resists. Due to the photoresist stripper, the resist is almost completely dissolved as tiny particles that are easy to filter. The product contains no potassium hydroxide solution, so copper and tin are not attacked. A highly effective anti-tarnish simultaneously prevents the oxidation of the copper surface.
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Photoresist Stripper SVD
Photo resist stripper
As a part of fabrication process of a semiconductor wafer, a number of layers removal techniques are used to get rid of any unwanted layers from the surface of a substrate while trying not to introduce any contamination. Photoresist are light-sensitive organic materials which are applied during photo lithography process to form a patterned coating on a surface to protect the underlying inorganic layers during electronic manufacturing steps. The photoresist layer thus need to be removed in the final stage of a manufacturing process by a photoresist stripper. Photoresist can be stripped away by two different techniques: One by applying a dry etch process using oxygen based plasma, and the other is to apply a wet clean process. For very fine or highly dense electronic devices, dry etch process is the preferred method as problems such as under-cutting or photoresist peeling would not occur. However, a dry etch process is much more expansive compared to a wet etch.
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Wafer Cleaning. There are a number of wafer cleaning techniques or steps employed to ensure that a semiconductor wafer is always free of contaminants and foreign materials as it undergoes the wafer fabrication process. Different contaminants have different properties, and therefore have different requirements for removal from the wafer.
Technic offers a number of photoresist strippers for residue removal , each with specialized characteristics and benefits, for use in semiconductor fabrication and packaging. As with all Technic products, we offer our extensive experience and the unparalleled customer service that has made Technic a respected resource for quality around the globe. A highly effective NMP free negative tone photoresist remover used mainly for TSV mask and solder bumping applications. NF52 successfully performs without any negative impact to the copper surface, preserving critical fine features that would otherwise be negatively impacted by photoresist strippers that can etch into fine surface details. Our photoresist is effective and compatible with numerous substrates.
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